As digital printing expands its reach, HP is continuing to enjoy growth. One area of growing interest is corrugated printing, and HP is making inroads in that segment with its PageWide series of printers.
 
During a briefing held this week, David Tomer, GM for HP Scitex, discussed the company’s latest developments in numerous areas, including its inks.
 
Tomer reported that HP sees the total addressable market for digital corrugated printing growing to $5.5 billion by 2022, up from $3.5 billion in 2017. To meet this demand, HP has developed sheet and web presses. The company sheetfed offerings range from the Scitex 15500 and 17000 to the new PageWide C500; the web presses include the PageWide T400S and the T1100 Series.
 
In particular, Tomer said that the C500 is a mainstream digital press, producing offset quality direct to board and able to produce jobs from a single item to thousands cost effectively. This allows customers to order for just in time delivery.
 
“We see the corrugated market as a huge opportunity for print,” Tomer noted, adding that HP already has nine signed contracts for the new press, installing one already at Smurfit Kappa.
 
HP’s water-based ink technology is a key driver in the company’s success. The inks, which are pigment-based, are certified for food and designed for both primary and secondary packaging.
 
“Fifty percent of corrugated printing is used for food and drink. Our PageWide true Water-Based inks are 100% free of UV reactive chemistries,” Tomer observed. “No additional barriers are required. They meet stringent standards, including NestléGuidance, the Swiss Ordinance, EuPIA GMP and FDA requirements.”
 
As for the PageWide T1100 series of presses, the T1100S offers CMYK, while the T1170 and T1190 include six colors – CMYK plus orange and violet.
 
Tomer noted that the new corrugated presses are opening new opportunities for HP, and ink will play a pivotal role.
 
“The ink is very important,” Tomer added. “Awareness of food safety is growing. We see maximum business opportunities for packaging applications.”